07/31/2019
NTT Laboratories starts a collaboration project to make their developed ultra-high-speed IC fabrication technology, which is based on the most advanced InP compound semiconductor R&D process, open. NTT calls for collaborating partners and distribute process design kits (PDK) to all partners. NTT aims to support partners in realizing their designed ICs with cutting edge compound semiconductor process technology, and in creating new services and new industries that use ultra-high-speed ICs. NTT also expect successive advancement of the InP technology though the collaboration.
Silicon-based ICs generally features highly functionality through large-scale integration exemplified CMOS, but there is a limit to boosting the operating speed and output power. InP-based ICs are not as well suited to high integration, but because they can achieve higher speeds and higher output than silicon, they are expected to serve as complementary technologies.

CMOS
Complementary metal oxide semiconductor. CMOS are used when realizing large-scale ICs, such as CPU, GPU and DSP featuring multiple function and complicated processing. This type of circuit is often used for high-capacity optical transmission and reception because of its available massive signal processing. Although scaling down in CMOS accelerates its operating speed, compound semiconductors are superior in terms of high speed and high output.
InP
Indium phosphide. This is a group III-V compound semiconductor consisting of indium and phosphorus. It is used to realize functions for applications that require to generate and handle high speed and high output power signal.
HBT
Heterojunction bipolar transistor
HEMT
High Electron Mobility Transistor
NTT Device Technology Laboratories - Photonics-Electronics Convergence Laboratory