研究成果 [2019]

  • S. Oki et al., “Effects of Soil Particle Size and Water Content on Corrosion Rate of Carbon Steel in Soil” in Corrosion Engineering, Accepted.
  • Y. Arikawa et al., “Hardware Architecture for On-sensor Neural Network Computing” in Proceedings of ESWEEK, Accepted.
  • R. Nakao et al., “Lateral-current-injection membrane laser diode directly bonded to SiC substrate” in Proceedings of KPS Fall Meeting, Accepted.
  • M. Nakajima et al., “Scalable and programmable on-chip reservoir computer” in Proceedings of Nature conference: Neuromorphic computing , Accepted.

  • T. Aihara et al., “Membrane buried-heterostructure DFB laser using an optically coupled III-V/Si waveguide” in Optics Express, 2019/12.
  • H. Hamada et al., “Millimeter-wave InP Device Technologies for Ultra-high Speed Wireless Communications toward 5G” in Proceedings of IEEE International Electron Devices Meeting (IEDM), 2019/12, (Invited).
  • Y. Yamada et al., “Minority-electron transport through InGaAs/a-Ge/InGaAs atomic-diffusion-bonded structure studied utilizing photodiode characterization” in Japanese Journal of Applied Physics, 2019/12.

  • J. Sakamoto et al., “Low-mode-crosstalk coupler using multistage mode conversion” in Optics Communications, 2019/11.
  • K. Shikama et al., “Analysis of nano-creep deformation of epoxy adhesive in optical fiber connector for long-term reliability prediction” in Optical Fiber Technology, 2019/11.
  • J. Sakamoto et al., “Single-Mode Polymer Embedded Waveguide for Visible Wavelength using SU-8" in J. Photopolym. Sci. Technol., 2019/11.
  • S. Sakamoto et al., “Electrochemical Properties of Lithium Air Secondary Batteries Incorporating Manganese Salen Complex as Soluble Catalyst for Nonaqueous Electrolyte Solutions" in Electrochemistry, 2019/11.
  • Y. Yoshiya et al., “Impact of selective thermal etching in NH3/H2 mixed atmosphere on crystal quality of AlGaN/GaN heterostructures" in Proceedings of Asia-Pacific Workshop on Widegap Semiconductors (APWS), 2019/11.
  • S. Katayose et al., “Ultra-compact 3D measurement module using silica-based PLC" in Proceedings of Microoptics Conference(MOC), 2019/11.
  • S. Sato et al., “Photoelectrochemical Gas-Phase CO2 Reduction Reaction on Cu Cathode Formed on Proton Exchange Membrane" in Proceedings of 3rd International Solar Fuels Conference (ISF-3) International Conference on Artificial Photosynthesis-2019 (ICARP2019), 2019/11.
  • Y. Uzumaki et al., “Stability of GaN-Based Photoanode for Water Splitting Reaction under Light Irradiation for 300 h" in Proceedings of 3rd International Solar Fuels Conference (ISF-3) International Conference on Artificial Photosynthesis-2019 (ICARP2019), 2019/11.
  • M. Nagatani et al., “A 110-GHz-Bandwidth 2:1 AMUX-Driver IC using 250-nm InP DHBTs for Beyond-1-Tb/s/carrier Optical Transmission Systems" in Proceedings of BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2019/11.
  • H. Hamada et al., “300 GHz 120 Gb/s Wireless Transceiver with High-Output-Power and High-Gain Power Amplifier Based on 80-nm InP-HEMT Technology" in Proceedings of BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2019/11.

  • Y. Tanaka et al., “Low Energy Fluence Photoacoustic Spectroscopy using Acoustic Wave Forming for Non-invasive Glucose Monitor” in Proceedings of IEEE SENSORS, 2019/10.
  • E. Matsunaga et al., “Paintable Wireless Passive Sensor based on Electromagnetic Waveguide to Detect Loose Bolts for Remote Infrastructure Inspection” in Proceedings of IEEE SENSORS, 2019/10.
  • S. Konisho et al., “A Novel Compact Architecture for Wavelength Selective Switches” in Proceedings of International Workshop on. Optical signal processing and Optical switching (IWOO), 2019/10, (Invited).

  • S. Konisho et al., “A COMPACT WSS INTEGRATED BY 1-f SPOC WITH DISPERSIVE METASURFACE AND SPECTRAL INTERLEAVER” in Proceedings of European Conference on Optical Communication (ECOC), 2019/9.
  • Y. Muranaka et al., “A route-and-select optical switch with flip-chip-bonded LVDS-compatible driver for sub-nanosecond switching” in Proceedings of European Conference on Optical Communication (ECOC), 2019/9.
  • T. Fujii et al., “Wide-Wavelength Range Membrane Laser Array Using Selectively Grown InGaAlAs MQWs on InP-on-insulator” in Proceedings of European Conference on Optical Communication (ECOC), 2019/9.
  • T. Aihara et al., “Membrane III-V/Si DFB laser with width modulated silicon waveguide for narrowing linewidth” in Proceedings of European Conference on Optical Communication (ECOC), 2019/9.
  • Y. Takeuchi et al., “Corrosion Examination of Rebar in Cracked Reinforced Concrete” in Proceedings of European Conference on Optical Communication (ECOC), 2019/9.
  • T. Hiraki et al., “LOSS-LESS OPERATION OF MEMBRANE III-V SEMICONDUCTOR MACH-ZEHNDER MODULATOR WITH OPTICAL AMPLIFIER ON SI WAVEGUIDE CIRCUITS” in Proceedings of European Conference on Optical Communication (ECOC), 2019/9.
  • S. Yamaoka et al., “239.3-Gbit/s net rate PAM-4 transmission using directly modulated membrane lasers on high-thermal-conductivity SiC” in Proceedings of European Conference on Optical Communication (ECOC), 2019/9.
  • T. Hashimoto et al., “Design Model for waveguide components on photonic integrated circuits based on wavefront-matching method” in Proceedings of European Conference on Optical Communication (ECOC), 2019/9, (Invited).
  • M. Shouji et al., “Ultrasonic Guided Wave Inspection of Anchor Rods Embedded in Soil” in Journal of Nondestructive Evaluation, 2019/9.

  • Y. Maeda et al., “Germanium Light Source for Wafer-Level Inspection” in Proceedings of Group 4 photonics, 2019/8.
  • T. Hiraki et al., “III-V/Si MOS Capacitor Mach-Zehnder Modulator with Low Temperature Sensitivity” in Proceedings of Group IV Photonics (GFP), 2019/8.

  • T. Tsutsumi et al., “Feasibility Study of Wafer-level Backside Process for InP-based ICs” in IEEE Transactions on Electron Devices, 2019/7.
  • T. Kashiwazaki et al., “Over-30-dB phase-sensitive amplification using a fiber-pigtailed PPLN waveguide module” in Proceedings of nonlinear optics, 2019/7.
  • M. Miyata et al., “Computational Spectral Imaging with Metasurface-based, Pixel-scale Color Splitters” in Proceedings of International Conference on Metamaterials, Photonic Crystals and Plasmonics, 2019/7.
  • H. Fukuda et al., “All Optical Performance Characterization of Silicon Mach-Zehnder Modulator for Wafer-Level Test” in Proceedings of Opto-Electronics and Communications Conference, 2019/7.
  • T. Kazama et al., “Low-Noise Phase Sensitive Amplification Using an Optically Phase-Locked Pump” in Proceedings of Opto-Electronics and Communications Conference, 2019/7, (Invited).
  • I. Salah_Eldinahmed et al., “Burst-mode optical-clock-pulse generator with enhanced sensitivity” in Proceedings of OECC/PSC, 2019/7.
  • T. Hiraki et al., “Heterogeneously integrated membrane III-V/Si photonic devices” in Proceedings of International Conference on Metamaterials, Photonic Crystals and Plasmonics, 2019/7, (Invited).
  • Y. Maeda et al., “Accurate Fiber Alignment Method using Silicon Photodiode on Grating Coupler for Wafer-Level Test” in Proceedings of Opto-Electronics and Communications Conference, 2019/7.
  • N. Diamantopoulos et al., “Membrane-based DMLs-on-Si for Energy-efficient 400GbE SDM Transmission” in Proceedings of Advanced Photonics Congress, 2019/7, (Invited)."
  • D. Matsunaga et al., “Novel calibration algorithm against convection changes for non-invasive measurement of core body temperature” in Proceedings of International Engineering in Medicine and Biology Conference, 2019/7.
  • M. Nagatani et al., “InP-HBT-based Ultrahigh-Speed AMUX ICs for Advanced Optical Communications Systems” in Proceedings of Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD), 2019/7, (Invited).

  • H. Hamada et al., “mm-Wave InP Power Amplifier for High Speed Wireless Communications” in Proceedings of International Microwave Symposium (IMS), 2019/6, (Invited).
  • Z. Xu et al., “A 241-GHz-Bandwidth Distributed Amplifier with 10-dBm P1dB in 0.25-um InP DHBT Technology” in Proceedings of International Microwave Symposium , 2019/6."
  • T. Miura et al., “Wafer level inspection platform on high volume photonic integrated circuits for drastic reduction of testing time” in Proceedings of SPIEOpticalMetrology, 2019/6.
  • K. Tanaka et al., “Distributed Deep Learning with FPGA Ring Allreduce” in Proceedings of International Supercomputing Conference, 2019/6.
  • Z. Xu et al., “An Accurate and Fast Permittivity Measurement for THz Imaging” in Proceedings of European Microfinance Network (EMN), 2019/6, (Invited).
  • T. Fujii et al., “Epitaxial Growth of III-V Materials on an InP/SiO2/Si Substrate for Heterogeneously Integrated Membrane Lasers” in Proceedings of ISUPT/SSPhF, 2019/6, (Invited).
  • T. Hiraki et al., “Membrane InGaAsP Mach-Zehnder modulator with SiN:D waveguides on Si platform” in Opt. Express, 2019/6.

  • S. Yamaoka et al., “High-temperature continuous-wave operation of 1.3-μm membrane distributed reflector lasers on SiC” in Proceedings of Conference on Lasers and Electro-Optics, 2019/5.
  • T. Hiraki et al., “Heterogeneously Integrated Low-power-consumption Semiconductor Optical Amplifier on Si Platform” in Proceedings of Conference on Lasers and Electro-Optics, 2019/5.
  • S. Mineta et al., “Corrosion Behavior of Steel Buried in Soil Under Natural Rainfall Conditions at Outdoor Test Field” in Proceedings of 235rd Electrochemical Society meeting, 2019/5.
  • Y. Shiratori et al., “Impact of Emitter Thermal Shunt for InP-based Double-Heterojunction Bipolar Transistors on SiC Substrate” in Proceedings of Low Temperature Bonding for 3D (LTB-3D), 2019/5.
  • T. Hoshi et al., “Impact of the insertion of AlGaN back barrier on crystal qualities, Ns and mobility of GaN-channel HEMT with high-Al-content AlGaN top barrier grown on high-resistivity Si substrate” in Proceedings of Compound Semiconductor Week , 2019/5.
  • S. Yamaoka et al., “Single-mode Continuous-wave Operation of 1.3-μm Membrane Distributed Reflector Lasers on SiC Wafers” in Proceedings of Compound Semiconductor Week, 2019/5.
  • T. Fujii et al., “Selective-area MOVPE growth of multi-λ InGaAlAs-based MQWs on patterned InP-on-insulator substrate” in Proceedings of Compound Semiconductor Week, 2019/5.
  • T. Tsurugaya et al., “Photonic-crystal Lasers with Extremely Short Embedded Active-regions” in Proceedings of Compound Semiconductor Week, 2019/5.
  • N. Diamantopoulos et al., “400-Gbps IM/DD SDM Transmission Based on Energy-Efficient DML-Array-on-Silicon” in Proceedings of International Symposium on Extremely Advanced Transmission Technologies (EXAT), 2019/5.
  • S. Oki et al., “Effect of Soil Particle Size on Corrosion Behavior of Buried Carbon Steel” in Proceedings of 235th ECS Meeting, 2019/5.

  • H. Nosaka et al., “Terahertz Electronics towards the Post-Moore Era” in Proceedings of IRDS Spring Conference , 2019/4, (Invited).
  • Y. Arikawa et al., “FPGA-based radio-resource scheduler for 5G mobile in NFV environments” in Communications Express, 2019/4.

  • I. Salah_Eldinahmed et al., “Novel Lambda-Rich Data Center Network: From Underlying Principles to Candidate Technologies” in Proceedings of Optical Fiber Communication Conference, 2019/3, (Invited).
  • T. Kishi et al., “A 25-Gbps x 4 ch, Low-Power Compact Wire-Bond-Free 3D-Stacked Transmitter Module with 1.3-um LD-Array-on-Si for On-Board Optics” in Proceedings of Optical Fiber Communication Conference, 2019/3.
  • T. Aihara et al., “56-Gbit/s Operations of Mach-Zehnder Modulators Using 300-μm-long Membrane InGaAsP Phase Shifters and SiN waveguides on Si” in Proceedings of Optical Fiber Communication Conference, 2019/3.
  • T. Hiraki et al., “III-V/Si integration technology for laser diodes and Mach-Zehnder modulators” in Japanese Journal of Applied Physics (JJAP), 2019/3.
  • M. Miyata et al., “Impedance-matched dielectric metasurfaces for non-discrete wavefront engineering” in J.Appl.Phys., 2019/3.
  • M. Miyata et al., “High-sensitivity color imaging using pixel-scale color splitters based on dielectric metasurfaces” in ACSPhotonics, 2019/3.

  • Y. Tanaka et al., “Resonant photoacoustic spectroscopy for a non-invasive blood glucose monitoring: human interface and temperature correction technology” in Proceedings of Photonics West, 2019/2.
  • J. Sakamoto et al., “Shape-optimized multi-mode interference for a wideband visible light coupler” in Opt. Commun., 2019/2.
  • M. Shimokozono et al., “Mode-hop free operation throughout lifetime confirmed in a 2μm distributed Bragg reflector laser for gas sensing” in Proceedings of Photonics West, 2019/2.
  • T. Hiraki et al., “Heterogeneous integration of III-V/Si Mach-Zehnder modulator with high-efficiency MOS capacitor phase shifter” in Proceedings of Photonics west, 2019/2, (Invited).
  • H. Wakita et al., “Recent advances in ultra-high-bandwidth coherent driver modulator” in Proceedings of Photonics West, 2019/2, (Invited).
  • Y. Muranaka et al., “Fast Optical Switching Technologies for Inter/Intra Data Center Networks” in Proceedings of SPIE PhotonicsWest Opto, 2019/2, (Invited).
  • T. Aihara et al., “III-V membrane lasers integrated with Si nanowire waveguide” in Proceedings of SPIE PhotonicsWest Opto, 2019/2, (Invited).

  • T. Hoshi et al., "InGaP/GaAsSb/InGaAsSb double heterojunction bipolar transistors with 703-GHz fmax and 5.4-V breakdown voltage" in IEICE Electronics Express, 2019/1.